Description
The Small Form Factor (SFF) 760 Series rugged electronic packaging design enables off-the-shelf Mini-ITX and PCIe commercial electronics CCAs to be deployed in SWAP and cost-constrained, harsh environments. These types of applications present many challenges to electronic components including extreme temperature ranges, vibration, shock, dust, salt, fog and more. Commercially available components, particularly Mini-ITX processor boards and PCIe expansion cards, are simply not designed to be utilized in these types of rugged, deployed applications. Often, this has prevented system integrators from choosing state-of-theart commercial electronics in favor of much more expensive rugged solutions designed specifically for the military market. The 760 Series currently has two variants.
Features
- Enables Use of Commercial Mini-ITX Processor in Rugged, Deployed Applications
- Rated for altitudes in excess of 50,000 feet
- Highly optimized for size, weight, and power (SWAP) constrained applications
- ESS screening validates ruggedness of production units
